Cypress CapSense CY8C20x36 Guía de usuario Pagina 4
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4 Document No. 001-64846 Rev. *I Getting Started with CapSense
®
2.8 Water Tolerance .................................................................................................................................................. 31
2.9 CapSense System Overview ............................................................................................................................... 31
2.9.1 Hardware Component ............................................................................................................................. 31
2.9.2 Firmware Component ............................................................................................................................. 32
3. Design Considerations ............................................................................................................................................... 33
3.1 Overlay Selection ................................................................................................................................................ 33
3.1.1 Overlay Material...................................................................................................................................... 33
3.1.2 Overlay Thickness .................................................................................................................................. 34
3.1.3 Overlay Adhesives .................................................................................................................................. 34
3.2 ESD Protection .................................................................................................................................................... 34
3.2.1 Preventing ESD Discharge ..................................................................................................................... 35
3.2.2 Redirect .................................................................................................................................................. 36
3.2.3 Clamp ..................................................................................................................................................... 36
3.3 Electromagnetic Compatibility (EMC) Considerations ......................................................................................... 37
3.3.1 Radiated Interference ............................................................................................................................. 37
3.3.2 Radiated Emissions ................................................................................................................................ 39
3.3.3 Conducted Immunity and Emissions ....................................................................................................... 40
3.4 Software Filtering ................................................................................................................................................. 41
3.4.1 Average Filter ......................................................................................................................................... 41
3.4.2 IIR Filter .................................................................................................................................................. 42
3.4.3 Median Filter ........................................................................................................................................... 44
3.4.4 Jitter Filter ............................................................................................................................................... 45
3.4.5 Event-Based Filters ................................................................................................................................ 47
3.4.6 Rule-Based Filters .................................................................................................................................. 47
3.5 Power Consumption ............................................................................................................................................ 47
3.5.1 Active and Sleep Current ........................................................................................................................ 47
3.5.2 Average Current ..................................................................................................................................... 47
3.5.3 Response Time versus Power Consumption .......................................................................................... 48
3.6 Pin Assignments .................................................................................................................................................. 48
3.7 PCB Layout Guidelines ....................................................................................................................................... 51
3.7.1 Parasitic Capacitance, C
P
....................................................................................................................... 51
3.7.2 Board Layers .......................................................................................................................................... 51
3.7.3 Board Thickness ..................................................................................................................................... 51
3.7.4 Button Design ......................................................................................................................................... 51
3.7.5 Slider Design .......................................................................................................................................... 52
3.7.6 Sensor and Device Placement ............................................................................................................... 52
3.7.7 Trace Length and Width ......................................................................................................................... 52
3.7.8 Trace Routing ......................................................................................................................................... 53
3.7.9 Crosstalk Solutions ................................................................................................................................. 53
3.7.10 Vias ......................................................................................................................................................... 54
3.7.11 Ground Plane ......................................................................................................................................... 54
3.7.12 Shield Electrode and Guard Sensor ....................................................................................................... 55
3.7.13 CapSense System Design with Single Layer PCB ................................................................................. 56
- Getting Started with CapSense 1
- Contents 3
- 1. Introduction 6
- 1.4 Document Conventions 9
- 2. CapSense Technology 10
- 2.1.2 Mutual-Capacitance 11
- 2.3.1 Sensing Methods 12
- CY8C21x34/B 13
- = External Connection 14
- 2.4 CapSense Tuning 15
- 2.4.3 Measuring SNR 16
- 2.4.4.1 What is SmartSense? 17
- 2.5 Sensor Types 19
- 2.5.1.2 Matrix Buttons 20
- 2.5.2.1 Linear Sliders 20
- 2.5.2.2 Diplexed Sliders 21
- Area contacted by finger 22
- Proximity Sensor 22
- 2.6 Sensor Construction 23
- 2.7.1 Visual Feedback 24
- OFFON OFF 26
- 2.7.2 Haptic Feedback 28
- 2.7.3 Audible Feedback 29
- 2.8 Water Tolerance 31
- CapSense Controller 32
- 3. Design Considerations 33
- 3.2 ESD Protection 34
- Non Conductive 35
- Material 35
- 3.2.2 Redirect 36
- 3.2.3 Clamp 36
- 3.3.1.1 Ground Plane 37
- 3.3.1.2 Series Resistor 37
- 3.3.1.3 Trace Length 37
- 3.3.1.4 Current Loop Area 37
- CapSense 38
- Controller 38
- 3.3.2 Radiated Emissions 39
- 3.4 Software Filtering 41
- 3.4.2 IIR Filter 42
- Equation 18 43
- 3.4.3 Median Filter 44
- 3.4.4 Jitter Filter 45
- Unfiltered 46
- Filtered 46
- 3.5 Power Consumption 47
- 3.6 Pin Assignments 48
- 3.7 PCB Layout Guidelines 51
- 3.7.5 Slider Design 52
- 3.7.8 Trace Routing 53
- 3.7.9 Crosstalk Solutions 53
- 3.7.10 Vias 54
- 3.7.11 Ground Plane 54
- Sensor-1 55
- Shield Electrode 56
- Guard Sensor 56
- Sensor Pads 56
- 4.1.1.1 CY8CMBR20xx 57
- 4.1.1.2 CY8C201xx 57
- 4.1.2.1 CY8C20x34, CapSense 57
- 5. CapSense Selector Guide 59
- Design Requirements 60
- 7. Resources 65
- 7.4.5 Evaluation Pods 66
- 7.5 Demonstration Kit 67
- 7.6 PSoC Designer 67
- 7.7 PSoC Programmer 68
- C-to-USB Bridge Kit 69
- 7.10 Design Support 71
- 8. Appendix 72
- Introduced Capacitance, pF 73
- 8.1.4 Design Examples 74
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