Cypress CY8CNP102B Manual de usuario descargar pdf (Pagina 36)

PRELIMINARY CY8CNP102B, CY8CNP102E

Document #: 001-43991 Rev. *D Page 36 of 38

Packaging Information

This section describes the packaging specifications for the PSoC NV device and the thermal impedances for TQFP package.

Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the emulation

tool dimensions, refer to the document “PSoC Emulator Pod Dimensions” at http://www.cypress.com/design/MR10161.

Thermal Impedance

Package Diagrams

Figure 15. 100-Pin TQFP - 14 x 14 x 1.4 mm

51-85048 *C

Note

10. * T

= T

+ POWER x θ

Table 41. Thermal Impedance

Package

[10]

Typical θ

* Typical θ

100 TQFP 26.14

C/W 5.81

C/W

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Cypress CY8CNP102B Manual de usuario Pagina 36